See Beyond the Surface
Advanced Wafer Analysis.
Our Wafer Analysis Service provides detailed inspection and metrology solutions to help customers assess wafer defect status and process conditions. Through advanced analysis techniques, we detect particles, scratches, and other contaminants, ensuring precise contamination control.
Additionally, we offer thin-film and total wafer thickness measurements to support process optimization and quality assurance. Our expertise enables semiconductor manufacturers to improve yield and maintain high production standards with reliable and accurate wafer analysis.
Wafer Inspection
Wafer inspection plays a vital role in semiconductor manufacturing by ensuring the integrity of wafers before progressing to later stages. This early defect detection helps optimize yields, minimize waste, and maintain the performance and reliability of semiconductor devices. IMSEMICON’ advanced inspection tools utilize cutting-edge technology, such as AI-powered defect analysis and defect imaging, to provide unparalleled precision. By combining defect detection with metrology, these solutions offer comprehensive insights into wafer quality, crucial for high-precision industries like MEMS, photonics, and power semiconductors.
Defect Detection
Defect Resolution. > 3µm
Defect Type. Scratch, Particle
Wafer Metrology
Our wafer metrology solutions ensure precise measurement and quality control in semiconductor manufacturing. We offer comprehensive services, including thin-film thickness measurement (front-side/back-side), total thickness analysis, and wafer warp, bow, and flatness evaluation. Additionally, we provide edge profile assessment, bonded wafer alignment measurement, and bump/PAD height analysis. These advanced metrology capabilities help optimize process efficiency, improve yield, and maintain the highest industry standards for semiconductor production.
Wafer Edge Profile – Bonded Wafer
Wafer Warp/Bow
Wafer Analysis Service
Our Wafer Inspection & Metrology Service enables precise monitoring and analysis of wafer changes throughout the semiconductor process. By detecting particles, scratches, and other defects, as well as measuring thin-film and total wafer thickness, we provide critical insights for process optimization and quality control. Ensure stable production and improved yield with our reliable and high-precision analysis solutions.
Wafer Variation Map
Wafer Mis-Alignment
